LITESURF plating technology

BENSCHEM, Germany - TE Connectivity Ltd. (NYSE: TEL) (TE), a global leader in connectivity and sensing solutions, today announced the LITESURF electroplating technology designed to reduce whisker risk and minimize Potential system failure due to whisker induced short circuit of electronic components. Compared to traditional tin plating technology, TE's new bismuth-free solder joint solution reduces the risk of whisker growth by at least 1/1600.

As the number of electronic devices in the car is increasing, component manufacturers are increasingly applying solderless technology to printed circuit board (PCB) connections. Plating should be applied to pins to help lubricate and prevent surface damage due to oxidation and other causes. In the past, the plating solution consisted of tin and lead (Pb). However, with the global phase-out of hazardous substances for production, today the metal terminal plating solution mainly consists of pure tin (Sn).

Tin does have its limitations. For example, whisker growth may occur when a tin film is pressed (such as when a pin is inserted into a PCB). Tin whiskers can grow long enough to bridge other metal components and, in extreme cases, can short circuit the electronic components and cause potential system problems. As a result, car component manufacturers are looking for new alternatives.

"Automotive manufacturers are aware of the solderless connection for their dependable technological advantages, but they need to eradicate the risk of whisker growth," said Frank Schabert, Senior R & D Manager. "Our LITESURF electroplating technology uses mainly bismuth, a non-hazardous substance, And has all of the beneficial features of tin, but at a very low risk of whisker growth. "Bismuth also makes it easy to replace tin on electroplating lines and can operate with almost no interruption in production."

 

TE will showcase its new LITESURF electroplating technology at Productronica in Munich from November 14 to 17, 2017.

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