Our LGA socket enables electrical connection between the processor and the PCB. With the increase of computing power, the number of chips is also increasing. The rugged bolster provides reliable interconnection with the microprocessor package and limits the degree of PCB flexing during crimping to ensure a reliable connection. The geometry of the terminal tips has been optimized to reduce the risk of damaging the terminals during handling and packaging. Our flexible molds provide quick prototyping cycles for technical samples so you can get a socket early in the project.
LGA 3647 socket hardware products
View LGA 3647 socket P0 hardware
We are a certified supplier of LGA 3647 socket products such as backplanes, pillowcases and clips / spindles for socket P0. With a narrow fabric and a narrow non-woven product, this new hardware system performs better calibration and keeps your fingers away from the socket contact field.
LGA 3647 socket
product detailed information
Pitch: 0.9906mm hexagonal
SP height: 2.7mm
Terminal force: 25gf @ nominal definition
Pin Count: 3647
Pin matrix: 49x74
Multi-chip housing: 2 slices
Features: LGA socket
Easy to weld and position
Socket housing facilitates efficient PCB soldering.
The socket is equipped with a cap for easy pick and place.
Backplane optional galvanized and nickel-plated layer.
High Performance Computing (HPC)
Workstations and desktop computers
The LGA socket uses the latest socket technology based on Intel and AMD LGA microprocessors, with up to 3647 pins. This generation of LGA sockets provide a compressed electrical interface to the microprocessor and are soldered to the PCB by solder ball surface mount. Stainless steel pressure plate allows reliable interconnection with the microprocessor, with a single lever handle for microprocessor-driven. The geometry of the terminal tip has been optimized to reduce the risk of terminal damage during operation and installation.